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XCVU080-H1FFVB1760E

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 702
Number of LABs/CLBs 55714
Number of Logic Elements/Cells 975000
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Part Status Active
Supplier Device Package 1760-FCBGA (42.5x42.5)
Total RAM Bits 51200000
Voltage - Supply 0.922V ~ 1.030V