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XCS30-3BG256C

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 30000
Number of I/O 192
Number of LABs/CLBs 576
Number of Logic Elements/Cells 1368
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BBGA
Part Status Obsolete
Supplier Device Package 256-PBGA (27x27)
Total RAM Bits 18432
Voltage - Supply 4.75V ~ 5.25V