XCKU3P-1FFVB676E

Images are representative; refer to the datasheet for complete specifications.

XCKU3P-1FFVB676E

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 280
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Part Status Active
Supplier Device Package 676-FCBGA (27x27)
Total RAM Bits 31641600
Voltage - Supply 0.825V ~ 0.876V