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XA3SD3400A-4FGG676I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 3400000
Number of I/O 469
Number of LABs/CLBs 5968
Number of Logic Elements/Cells 53712
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Part Status Obsolete
Supplier Device Package 676-FBGA (27x27)
Total RAM Bits 2322432
Voltage - Supply 1.14V ~ 1.26V