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XCVU9P-3FLGA2577E

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 448
Number of LABs/CLBs 147780
Number of Logic Elements/Cells 2586150
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2577-BBGA, FCBGA
Part Status Active
Supplier Device Package 2577-FCBGA (52.5x52.5)
Total RAM Bits 391168000
Voltage - Supply 0.873V ~ 0.927V