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XCVU29P-L2FSGA2577E

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 448
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2577-BBGA, FCBGA
Part Status Active
Supplier Device Package 2577-FCBGA (52.5x52.5)
Total RAM Bits 99090432
Voltage - Supply 0.698V ~ 0.742V