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XCVU27P-1FIGD2104I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 676
Number of LABs/CLBs 162000
Number of Logic Elements/Cells 2835000
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Part Status Active
Supplier Device Package 2104-FCBGA (52.5x52.5)
Total RAM Bits 74344038
Voltage - Supply 0.825V ~ 0.876V