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XCVU13P-2FHGA2104E

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 832
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Part Status Active
Supplier Device Package 2104-FCBGA (52.5x52.5)
Total RAM Bits 514867200
Voltage - Supply 0.825V ~ 0.876V