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XCVU11P-3FLGF1924E

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 624
Number of LABs/CLBs 162000
Number of Logic Elements/Cells 2835000
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1924-BBGA, FCBGA
Part Status Active
Supplier Device Package 1924-FCBGA (45x45)
Total RAM Bits 396150400
Voltage - Supply 0.873V ~ 0.927V