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XCV1600E-6FG860I
- Manufacturer
- AMD Xilinx
- Category
- Package / Case
- —
Product Specifications
11 specifications
Mounting Type
Surface Mount
Number of Gates
2188742
Number of I/O
660
Number of LABs/CLBs
7776
Number of Logic Elements/Cells
34992
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
860-BGA Exposed Pad
Part Status
Obsolete
Supplier Device Package
860-FBGA (42.5x42.5)
Total RAM Bits
589824
Voltage - Supply
1.71V ~ 1.89V