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XCV1000E-6FG860I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 1569178
Number of I/O 660
Number of LABs/CLBs 6144
Number of Logic Elements/Cells 27648
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 860-BGA Exposed Pad
Part Status Obsolete
Supplier Device Package 860-FBGA (42.5x42.5)
Total RAM Bits 393216
Voltage - Supply 1.71V ~ 1.89V