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XCKU9P-L1FFVE900I

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 304
Number of LABs/CLBs 34260
Number of Logic Elements/Cells 599550
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Part Status Active
Supplier Device Package 900-FCBGA (31x31)
Total RAM Bits 41881600
Voltage - Supply 0.698V ~ 0.876V