XCKU3P-2FFVA676I

Images are representative; refer to the datasheet for complete specifications.

XCKU3P-2FFVA676I

Manufacturer
AMD Xilinx
Package / Case
—
Description
IC FPGA 256 I/O 676FCBGA

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 256
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Part Status Active
Supplier Device Package 676-FCBGA (27x27)
Total RAM Bits 31641600
Voltage - Supply 0.825V ~ 0.876V