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XCKU085-L1FLVB1760I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 676
Number of LABs/CLBs 62190
Number of Logic Elements/Cells 1088325
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Part Status Active
Supplier Device Package 1760-FCBGA (42.5x42.5)
Total RAM Bits 58265600
Voltage - Supply 0.880V ~ 0.979V