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XCAU20P-L1FFVB676I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 228
Number of LABs/CLBs 13625
Number of Logic Elements/Cells 238437
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Part Status Active
Supplier Device Package 676-FCBGA (27x27)
Total RAM Bits 7340032
Voltage - Supply 0.698V ~ 0.742V