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XC7VX330T-2FFG1761I

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 700
Number of LABs/CLBs 25500
Number of Logic Elements/Cells 326400
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Part Status Active
Supplier Device Package 1761-FCBGA (42.5x42.5)
Total RAM Bits 27648000
Voltage - Supply 0.97V ~ 1.03V