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XC7K70T-2FBG676C

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 300
Number of LABs/CLBs 5125
Number of Logic Elements/Cells 65600
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Part Status Active
Supplier Device Package 676-FCBGA (27x27)
Total RAM Bits 4976640
Voltage - Supply 0.97V ~ 1.03V