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XC7K325T-L2FFG900E

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 500
Number of LABs/CLBs 25475
Number of Logic Elements/Cells 326080
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Part Status Active
Supplier Device Package 900-FCBGA (31x31)
Total RAM Bits 16404480
Voltage - Supply 0.87V ~ 0.93V