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XC7K160T-3FFG676E

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 400
Number of LABs/CLBs 12675
Number of Logic Elements/Cells 162240
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Part Status Active
Supplier Device Package 676-FCBGA (27x27)
Total RAM Bits 11980800
Voltage - Supply 0.97V ~ 1.03V