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XC7A75T-2FGG676C

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 300
Number of LABs/CLBs 5900
Number of Logic Elements/Cells 75520
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Part Status Active
Supplier Device Package 676-FBGA (27x27)
Total RAM Bits 3870720
Voltage - Supply 0.95V ~ 1.05V