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XC6SLX75-N3FG676I
- Manufacturer
- AMD Xilinx
- Category
- Package / Case
- —
Product Specifications
10 specifications
Mounting Type
Surface Mount
Number of I/O
408
Number of LABs/CLBs
5831
Number of Logic Elements/Cells
74637
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
676-BGA
Part Status
Obsolete
Supplier Device Package
676-FBGA (27x27)
Total RAM Bits
3170304
Voltage - Supply
1.14V ~ 1.26V