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XC6SLX45-2FGG676I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 358
Number of LABs/CLBs 3411
Number of Logic Elements/Cells 43661
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Part Status Active
Supplier Device Package 676-FBGA (27x27)
Total RAM Bits 2138112
Voltage - Supply 1.14V ~ 1.26V