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XC6SLX25T-3FGG484C

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 250
Number of LABs/CLBs 1879
Number of Logic Elements/Cells 24051
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Part Status Active
Supplier Device Package 484-FBGA (23x23)
Total RAM Bits 958464
Voltage - Supply 1.14V ~ 1.26V