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XC4062XL-2BG560C

Manufacturer
AMD Xilinx
Package / Case
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Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 62000
Number of I/O 384
Number of LABs/CLBs 2304
Number of Logic Elements/Cells 5472
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 560-LBGA Exposed Pad, Metal
Part Status Obsolete
Supplier Device Package 560-MBGA (42.5x42.5)
Total RAM Bits 73728
Voltage - Supply 3V ~ 3.6V