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XC3SD3400A-4FGG676C
- Manufacturer
- AMD Xilinx
- Category
- Package / Case
- —
Product Specifications
11 specifications
Mounting Type
Surface Mount
Number of Gates
3400000
Number of I/O
469
Number of LABs/CLBs
5968
Number of Logic Elements/Cells
53712
Operating Temperature
0°C ~ 85°C (TJ)
Package / Case
676-BGA
Part Status
Active
Supplier Device Package
676-FBGA (27x27)
Total RAM Bits
2322432
Voltage - Supply
1.14V ~ 1.26V