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XC3S5000-4FG900I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 5000000
Number of I/O 633
Number of LABs/CLBs 8320
Number of Logic Elements/Cells 74880
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA
Part Status Active
Supplier Device Package 900-FBGA (31x31)
Total RAM Bits 1916928
Voltage - Supply 1.14V ~ 1.26V