No image available
XC3S2000-4FGG900C
- Manufacturer
- AMD Xilinx
- Category
- Package / Case
- —
Product Specifications
11 specifications
Mounting Type
Surface Mount
Number of Gates
2000000
Number of I/O
565
Number of LABs/CLBs
5120
Number of Logic Elements/Cells
46080
Operating Temperature
0°C ~ 85°C (TJ)
Package / Case
900-BBGA
Part Status
Active
Supplier Device Package
900-FBGA (31x31)
Total RAM Bits
737280
Voltage - Supply
1.14V ~ 1.26V