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XC3S1000-5FGG676C

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 1000000
Number of I/O 391
Number of LABs/CLBs 1920
Number of Logic Elements/Cells 17280
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Part Status Active
Supplier Device Package 676-FBGA (27x27)
Total RAM Bits 442368
Voltage - Supply 1.14V ~ 1.26V