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XC3S1000-4FGG676I
- Manufacturer
- AMD Xilinx
- Category
- Package / Case
- —
Product Specifications
11 specifications
Mounting Type
Surface Mount
Number of Gates
1000000
Number of I/O
391
Number of LABs/CLBs
1920
Number of Logic Elements/Cells
17280
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
676-BGA
Part Status
Active
Supplier Device Package
676-FBGA (27x27)
Total RAM Bits
442368
Voltage - Supply
1.14V ~ 1.26V