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XC2VP30-6FG676C

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 416
Number of LABs/CLBs 3424
Number of Logic Elements/Cells 30816
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Part Status Obsolete
Supplier Device Package 676-FBGA (27x27)
Total RAM Bits 2506752
Voltage - Supply 1.425V ~ 1.575V