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XC2VP2-6FGG456C

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 156
Number of LABs/CLBs 352
Number of Logic Elements/Cells 3168
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Part Status Obsolete
Supplier Device Package 456-FBGA (23x23)
Total RAM Bits 221184
Voltage - Supply 1.425V ~ 1.575V