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XC2S100-6FG456C

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

11 specifications
Mounting Type Surface Mount
Number of Gates 100000
Number of I/O 196
Number of LABs/CLBs 600
Number of Logic Elements/Cells 2700
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Part Status Obsolete
Supplier Device Package 456-FBGA (23x23)
Total RAM Bits 40960
Voltage - Supply 2.375V ~ 2.625V