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XA7S75-2FGGA676I

Manufacturer
AMD Xilinx
Package / Case
—

Product Specifications

10 specifications
Mounting Type Surface Mount
Number of I/O 400
Number of LABs/CLBs 6000
Number of Logic Elements/Cells 76800
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Part Status Active
Supplier Device Package 676-FPBGA (27x27)
Total RAM Bits 3317760
Voltage - Supply 0.95V ~ 1.05V