MSC8101M1375F

Images are representative; refer to the datasheet for complete specifications.

MSC8101M1375F

Manufacturer
NXP
Package / Case
—

Product Specifications

12 specifications
Clock Rate 275MHz
Interface Communications Processor Module (CPM)
Mounting Type Surface Mount
Non-Volatile Memory External
On-Chip RAM 512KB
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 332-BFBGA, FCBGA
Part Status Obsolete
Supplier Device Package 332-FCBGA (17x17)
Type SC140 Core
Voltage - Core 1.60V
Voltage - I/O 3.30V