M2GL060-FGG676I

Images are representative; refer to the datasheet for complete specifications.

M2GL060-FGG676I

Manufacturer
Microchip
Package / Case
—
Description
IC FPGA 387 I/O 676FBGA

Product Specifications

9 specifications
Mounting Type Surface Mount
Number of I/O 387
Number of Logic Elements/Cells 56520
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Part Status Active
Supplier Device Package 676-FBGA (27x27)
Total RAM Bits 1869824
Voltage - Supply 1.14V ~ 2.625V