BBN6203BGNY30C

Images are representative; refer to the datasheet for complete specifications.

BBN6203BGNY30C

Manufacturer
Texas Instruments
Package / Case
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Product Specifications

12 specifications
Clock Rate 300MHz
Interface McBSP
Mounting Type Surface Mount
Non-Volatile Memory External
On-Chip RAM 896kB
Operating Temperature 0°C ~ 90°C (TC)
Package / Case 384-FBGA, FCCSPBGA
Part Status Not For New Designs
Supplier Device Package 384-FC/CSP (18x18)
Type Fixed Point
Voltage - Core 1.50V
Voltage - I/O 3.30V